Driven by global sustainable development goals and the green manufacturing upgrade of the electronics industry, semiconductor packaging materials are undergoing a critical transformation. As a core enabler of the electronics sector, packaging materials now face the dual demand of performance enhancement and green transition. In this context, environmental friendliness, regulatory compliance, and full lifecycle sustainability have become new benchmarks of enterprise competitiveness. Trends toward low carbon, halogen-free, and bio-based substitutes are increasingly prominent, with halogen-free packaging materials now accounting for 41% of the market. Electronic-grade sorbitol, with outstanding performance and eco-friendly advantages, is gradually emerging as a key enabler of the green transformation of packaging materials.

1. Sustainable development drives material upgrades

Major economies are strengthening carbon neutrality and green manufacturing goals. Regulations such as the EU RoHS and WEEE directives have tightened restrictions on lead, mercury, halogens, and other hazardous substances. In China, semiconductor packaging materials are included in the “14th Five-Year Plan” list of strategic key materials, with targets for eco-friendly packaging material penetration rising to 65% by 2025. Downstream chip manufacturers and end-user brands are strengthening ESG management, imposing high standards on supply chain green attributes and carbon footprints, which in turn pressures upstream material suppliers to accelerate transformation. National subsidies and tax incentives have driven domestic R&D investment up by 23% year-on-year, promoting the development of low-carbon and sustainable packaging materials.

2. Packaging technology upgrades raise material requirements

Emerging applications such as 5G, AI, and automotive electronics are accelerating the adoption of 2.5D/3D packaging and Chiplet architectures, placing higher demands on materials. Industry standards for high-temperature resistance, electrical insulation, mechanical reliability, and long-term performance have increased by more than 30% compared to traditional requirements. AI chips and automotive electronics account for over 60% of incremental demand for packaging materials, requiring materials to balance processability with in-service performance, meet electronic-grade purity standards (metal ions ≤ 10 ppb), and ensure batch-to-batch consistency for wafer-level and fan-out packaging applications.

3. Advantages of electronic-grade sorbitol

Sorbitol, derived from natural starch and refined through catalytic hydrogenation, offers renewable, bio-based, and low-toxicity benefits. Through distillation, ion exchange, and membrane separation, it achieves 99.99% purity, metal ions ≤10 ppb, and batch variability ≤0.1%, fully meeting the impurity and consistency requirements of electronic materials. Its stable molecular structure with six hydroxyl groups is highly compatible with epoxy, phenolic, and other resins, enhancing material flexibility (elongation at break +20–30%), processing flow (melt flow rate +15%), and interfacial adhesion, effectively addressing cracking and delamination in advanced packaging.

4. Application value in halogen-free packaging systems

Halogen-free design has become a central focus of green packaging materials, with EU RoHS 2.0 and Chinese regulations restricting bromine, chlorine, and other halogens. Electronic-grade sorbitol is halogen-free, reducing environmental risks and regulatory pressure from the source. With thermal decomposition temperatures ≥250 °C and excellent thermal stability, it withstands high-temperature curing processes (180–220 °C) and long-term service conditions, making it particularly suitable for power devices and automotive electronics. It has demonstrated good compatibility and application potential in high-performance packaging systems such as polyimides and benzoxazines.

5. Broad prospects for bio-based fine chemicals

Selection of semiconductor materials is increasingly shifting from single performance metrics to comprehensive evaluation including carbon footprint, renewability, and sustainability. Electronic-grade sorbitol excels in combining performance with eco-friendliness, aligning with domestic high-end electronic chemical substitution needs. Currently, China’s domestic packaging material production accounts for about 45%, with high-end epoxy molding compounds and underfill materials still reliant on imports, presenting significant replacement potential. Through formulation optimization and process adaptation, electronic-grade sorbitol is expected to achieve scalable applications, reducing carbon emissions by over 30% while strengthening the local green supply chain and enhancing overall competitiveness.

Conclusion

Against the backdrop of reinforced sustainable development goals and advanced packaging technology iteration, semiconductor packaging materials are rapidly moving toward green, low-carbon, and high-performance integration. Electronic-grade sorbitol, with its renewable origin, stable properties, and regulatory compliance, provides a viable pathway for the green transformation of packaging materials, with the potential to break import dependence and support China’s semiconductor industry in achieving sustainable, high-quality growth through technological upgrading and industrial breakthrough.