As semiconductor processes advance toward 2nm and 3nm nodes, AI chips and automotive-grade chips are imposing increasingly stringent requirements on the corrosion resistance and long-term stability of packaging materials. Electronic-grade glycerol-modified packaging materials have emerged to meet these demands. Through molecular structure optimization, these materials significantly enhance density and corrosion resistance, extending the lifetime of semiconductor devices by 3–5 times, effectively addressing reliability bottlenecks in high-end packaging and providing critical support for the high-end upgrade of the semiconductor industry chain.

1. Molecular modification breakthroughs establish a core corrosion-resistant barrier.

Electronic-grade glycerol (purity≥99.99%) is modified through glycidyl ether reactions to produce derivatives such as glycerol triglycidyl ether, replacing traditional epichlorohydrin raw materials and eliminating chloride ion introduction at the source. The modified packaging materials form a dense cross-linked structure that effectively blocks moisture and chemical corrosion, preventing oxidation of metal pads. Experimental data show that traditional packaging materials cause ≥85% corrosion on copper pads, while electronic-grade glycerol-modified materials produce only minor surface oxidation, representing a qualitative leap in corrosion resistance.

2. Multi-dimensional performance optimization adapts to high-end packaging scenarios.

Electronic-grade glycerol-modified packaging materials combine low viscosity, high toughness, and excellent compatibility to meet the demands of advanced packaging. Viscosity can be reduced to 500–1500 mPa·s (25℃), over 80% lower than traditional materials, enabling precise filling of narrow chip gaps and reducing bubble defects. By adjusting crosslink density, the material achieves a tensile strength of 65 MPa and flexural strength of 110 MPa, maintaining mechanical performance while keeping the heat deflection temperature above 75℃, suitable for high-temperature chip operating environments.

3. Mature mass production processes ensure scalable supply.

Domestic collaborations between industry, academia, and research institutes have advanced biobased synthesis and precision purification technologies, enabling ten-thousand-ton-level production of electronic-grade glycerol-modified packaging materials. Purity and impurity control meet international standards. Closed-loop production processes keep VOC content below 0.5% with no free phenolic impurities, compliant with EU REACH and domestic environmental regulations, while production costs are 15%–20% lower than imported equivalents, laying the foundation for large-scale applications.

4. Targeted application scenarios empower multi-domain device upgrades.

This material is widely used in AI chips, automotive-grade chips, and HBM memory packaging. In 85℃/85% relative humidity testing, devices maintain 99.8% electrical performance stability after 1,000 hours. In automotive electronics, its oil and temperature resistance adapts to extreme conditions from –40℃ to 150℃; in data center computing chip packaging, it extends equipment service life and reduces maintenance costs, with application adoption continuing to rise.

5. Policy and market drivers expand growth potential.

The global semiconductor packaging materials market continues to grow, with advanced packaging materials accounting for 35% of demand in 2026. Policies encourage domestic substitution of high-end packaging materials. Electronic-grade glycerol-modified packaging materials, with their corrosion resistance, meet high-end chip reliability requirements. Market penetration is expected to rise from 12% in 2026 to 28% by 2030, with particularly strong growth in high-performance computing and automotive electronics, establishing a new growth driver in the packaging materials sector.

Conclusion

The mass production and application of electronic-grade glycerol-modified packaging materials solve corrosion challenges in high-end semiconductor devices, driving the transition of packaging materials toward high performance and sustainability. In the future, as processes continue to optimize and application scenarios expand, their value in extending device lifetime and enhancing reliability will become increasingly prominent. The industry should focus on iterative material performance improvements and cost control, deepen supply chain collaboration, and help the semiconductor industry overcome packaging technology bottlenecks, strengthening global competitiveness.